Product summary

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

Component Material of the Tools・Bond

Vitrified bond
Metal bond
Resin bond

Use

Ceramics
Quartz
Semiconductor wafers